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Intel Malaysia draws HBM packaging flows from Taiwan

Intel · Aug 20, 2026 · DigiTimes
Intel Malaysia draws HBM packaging flows from Taiwan
semiconductor-supplyai-chip-demandsupply-chain-disruption

Intel's expansion in Malaysia signals a shift in semiconductor supply chains, potentially diversifying high-bandwidth memory (HBM) packaging away from Taiwan and strengthening Intel's global manufacturing footprint amidst rising demand for AI chips.

View source · DigiTimes ↗More Intel news →

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